Molding machine for semiconductor package

Details Molding machine for semiconductor package Molding machine for semiconductor package

1994-09-01

1996-03-26

Nguyen, Khanh P.

Plastic article or earthenware shaping or treating: apparatus

Distinct means to feed, support or manipulate preform stock...

Opposed registering coacting female molds

4251291, 425145, 425185, 425190, 425544, 26427217, B29C 4502, B29C 4514

Patent

active

055015875

ABSTRACT:
A molding machine is provided for a semiconductor package. The machine has two transfer rods for compressing resin into a leadframe of the mold. One transfer rod will move resin into the mold when the rod is moved downward and the second transfer rod will move resin into the mold when the rod is moves upwardly. Means are provided for selectively operating the transfer rods as needed depending on the type of mold used.

REFERENCES:
patent: 4511317 (1985-04-01), Bandoh
patent: 4615857 (1986-10-01), Baird
patent: 4632653 (1986-12-01), Plocher
patent: 4723899 (1988-02-01), Osada
patent: 5326243 (1994-07-01), Fierkens

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