Wire bonding apparatus

Details Wire bonding apparatus Wire bonding apparatus

1994-11-19

1996-03-26

Heinrich, Samuel M.

Metal fusion bonding

Means to apply vibratory solid-state bonding energy to work

228105, H01L 21607

Patent

active

055013880

ABSTRACT:
A bonding apparatus used in manufacturing, for example semiconductor devices, including an adiabatic plate provided beneath a bonding horn for blocking the radiant heat from a heating block that heats up a workpiece. The apparatus further includes horn cooling pipes and a mirror tube cooling pipe for blowing cooling air onto a bonding horn and onto a mirror tube of a detection camera or a detection camera supporting arm.

REFERENCES:
patent: 4877173 (1989-10-01), Fujimoto et al.

Affiliated with

Also associated with

Rating

Wire bonding apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Wire bonding apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wire bonding apparatus will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-911419