Patent
1970-06-18
1976-05-25
Edlow, Martin H.
357 89, H01L 2934
Patent
active
039598101
ABSTRACT:
A method for manufacturing a PNP type planar transistor, diffusing an acceptor impurity in a non-oxidizing atmosphere to form a P type emitter region in one portion of an N type base region with a first silicon oxide film as a selective mask, depositing a second silicon oxide film from vapor phase on the surface of said emitter region, diffusing selectively a donor impurity in another portion of said base region with said first and second silicon oxide films as selective masks thereby to form an N type highly doped region in said base region.
REFERENCES:
patent: 3226611 (1965-12-01), Halnichen
patent: 3303069 (1967-02-01), Tokuyama
patent: 3338758 (1967-09-01), Tremere
patent: 3418181 (1968-12-01), Robinson
Edlow Martin H.
Hitachi , Ltd.
LandOfFree
Method for manufacturing a semiconductor device and the same does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for manufacturing a semiconductor device and the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for manufacturing a semiconductor device and the same will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-909986