Tape carrier for tape automated bonding process and a method of

Details Tape carrier for tape automated bonding process and a method of Tape carrier for tape automated bonding process and a method of

1988-06-22

1989-09-12

Ostrager, Allen M.

Special receptacle or package

For a vehicle

B65D 8530, B65D 7302, H05K 500

Patent

active

048651931

ABSTRACT:
A tape carrier utilized in the tape automated bonding of semiconductor chips is disclosed which comprises a polyimide tape-shaped film having apertures therein, and patterns of leads and reinforcing members formed on a surface of the film. The reinforcing members may be made of the same material as the leads, such as copper, and formed by a single photoetching process on the film. The reinforcing members are disposed on those areas of the film which lie outside of the leads and which are subjected to stress during the sealing of the semiconductor chips into a resinous mold subsequent to the inner lead bonding thereof. For example, the reinforcing members may be disposed in the lead supporting zones of the film, or around the corners of the outer-lead apertures. The reinforcing members reduces the stresses exerted on the leads during the molding of the chips, so that the deformations thereof during the same process are minimized.

REFERENCES:
patent: 4438847 (1984-03-01), Fritz
patent: 4812421 (1989-03-01), Jung et al.

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