Hermetic glass chip carrier

Details Hermetic glass chip carrier Hermetic glass chip carrier

1987-03-25

1989-08-08

James, Andrew J.

Electricity: conductors and insulators

Feedthrough or bushing

Compression

357 73, 174 524, H01L 2308, H01L 2350, H01L 2330

Patent

active

048558087

ABSTRACT:
A hermetically sealed glass chip carrier includes an outer glass ring and an inner glass base in which leads to the inner glass base pass between the ring and the base, with the ring, base and leads being sealed together by melting the glass in the vicinity of the seal. In one embodiment, the base includes a stepped annular lip with the leads protruding between the space between the base and the lip and onto the top surface of the lip. In an alternative embodiment, a Kovar substrate pad may be secured to the base. Complete hermetic sealing is accomplished through the use of a lid which contacts the top surface of the ring and is hermetically sealed thereto. The external leads may be formed and trimmed in various configurations to provide an elevated pad, a plug-in, or a socket-type configuration.

REFERENCES:
patent: 3381080 (1968-04-01), Stelmak
patent: 3482419 (1969-12-01), Rogers et al.
patent: 4190735 (1980-02-01), Checki, Jr.
patent: 4742182 (1988-05-01), Fuchs

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