Mounting device of electronic components and a mounting method

Details Mounting device of electronic components and a mounting method Mounting device of electronic components and a mounting method

1994-09-29

1996-03-26

Echols, P. W.

Metal working

Method of mechanical manufacture

Electrical device making

29832, 29840, 29721, 29741, 29759, 295642, 295661, 221 25, 221 74, H05K 330, H05K 334, B23P 1900, G07F 1166

Patent

active

055010059

ABSTRACT:
In an apparatus for mounting electronic components, punched out from film carriers to a substrate, there is disclosed an upper die for punching the electronic components through a hole formed in a lower die. A take out nozzle is located under the through hole for sucking the punched out electronic component from the hole in the lower die. A transfer nozzle is provided for receiving the electronic component from the take out nozzle and for transmitting the electronic component to a substrate mounted on a movable table. Before any leadwires of the component are bonded to the electrodes of the substrate, the table is finely positioned to property align the leadwires and the electrodes.

REFERENCES:
patent: 4850780 (1989-07-01), Safabakhsh
patent: 5027505 (1991-07-01), Nakamura et al.
patent: 5342460 (1994-08-01), Hidese

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