High current press pack semiconductor device having a mesa struc

Details High current press pack semiconductor device having a mesa struc High current press pack semiconductor device having a mesa struc

1982-03-25

1983-08-30

James, Andrew J.

357 71, 357 68, 357 81, H01L 2342, H01L 2344, H01L 2346

Patent

active

044020040

ABSTRACT:
A press pack semiconductor device comprising a semiconductor element having a mesa formed on a main surface thereof, first, second and third electrodes, a supporting plate fixed to the third electrode, a first intermediate plate which is movably attached to the surface of the first electrode and which is thin, a first disc and a second disc respectively electrically connected through the first intermediate plate to the first electrode and through the supporting plate to the third electrode and a housing surrounding the semiconductor element. The first intermediate plate protects the semiconductor element from being subjected to great stress.

REFERENCES:
patent: 3525910 (1970-08-01), Philips
patent: 3581163 (1971-05-01), Eriksson
patent: 3652904 (1972-03-01), Takahashi et al.
patent: 3654529 (1972-04-01), Lord
patent: 4035831 (1977-07-01), Saeki
patent: 4099201 (1978-07-01), Mueller
patent: 4127863 (1978-11-01), Kurata
patent: 4141030 (1979-02-01), Eisele et al.
patent: 4155155 (1979-05-01), Bourdon
patent: 4156963 (1979-06-01), Tsuji et al.
patent: 4246596 (1981-01-01), Iwasaki

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