Method of cutting masking sheet to be used to process silicon wa

Details Method of cutting masking sheet to be used to process silicon wa Method of cutting masking sheet to be used to process silicon wa

1996-07-19

1998-09-15

Mills, Gregory L.

Electric heating

Metal heating

By arc

21912183, 21912185, B23K 2602

Patent

active

058082743

ABSTRACT:
A method of cutting away the unnecessary portions of a masking sheet bonded to a silicon wafer during the IC manufacturing process. The method uses a laser cutting device which includes an optical fiber containing silver halide and a CCD camera to control the position of the laser focal point.

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