Drainage structure in polishing plant and method of polishing us

Details Drainage structure in polishing plant and method of polishing us Drainage structure in polishing plant and method of polishing us

1997-11-13

2000-09-12

Eley, Timothy V.

Abrading

Abrading process

Utilizing fluent abradant

451 54, 451 60, 451 67, 451288, 451446, B24B 100, B24B 5700

Patent

active

061169862

ABSTRACT:
A polishing plant includes a polishing apparatus having a top ring for holding a workpiece and a turn table for polishing a surface of the workpiece held by the top ring. A cleaning apparatus has cleaning machines for cleaning the workpiece polished by the polishing apparatus. At least one drainage pipe connected to the polishing apparatus discharges a waste liquid from the polishing apparatus, and at least one drainage pipe connected to the cleaning apparatus to discharges a waste liquid from the cleaning apparatus are provided as separate plural of drainage pipe lines, depending on the type of waste liquid. By use of the polishing plant of the present invention, treatment waste liquids can be efficiently conducted.

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Patent Abstracts of Japan, vol. 096, No. 11, Nov. 29, 1996 & JP 08 187660 A (Ebara Corporation), Jul. 23, 1996.
U.S. Patent Application, Serial No. 08/845,423, filed Apr. 25, 1997, entitled "Polishing Apparatus", by Tetsuji Togawa et al., located in Group Art Unit 3203.
U.S. Patent Application, Serial No. 08/787,916 filed Jan. 23, 1997, entitled "Polishing Apparatus", by Tetsuji Togawa et al., located in Group Art Unit 1104.

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