Power semiconductor device assembly having a lead frame with int

Details Power semiconductor device assembly having a lead frame with int Power semiconductor device assembly having a lead frame with int

1978-11-09

1980-07-29

James, Andrew J.

Electricity: conductors and insulators

Feedthrough or bushing

Compression

357 68, 357 72, 357 79, 357 81, 29588, 29589, 29591, 29575, 174 52PE, H01L 2348, H01L 2944, H01L 2952

Patent

active

042153603

ABSTRACT:
A power semiconductor device package is made using a subassembly of a die mount substrate and a lead frame. The subassembly is interlocked in a manner that permits relative movement without losing alignment. A method is described in which the lead frame interlock has a first position to facilitate making electrical interconnections. In a second position, package encapsulation is facilitated. In a preferred embodiment the lead frame interlocks with an element lightly press fitted in package mount holes in the die mount substrate. After package encapsulation, the interlock element is pressed out of the substrate to separate unused parts of the lead frame from the package and to make the substrate holes available for package mount.

REFERENCES:
patent: 3258662 (1966-06-01), Fleming
patent: 3434018 (1969-03-01), Boczar et al.
patent: 3449506 (1969-10-01), Weinstein
patent: 3466467 (1969-09-01), Houcke et al.
patent: 3686541 (1972-08-01), Livezey et al.
patent: 3689683 (1972-09-01), Daletto et al.
patent: 3922712 (1975-11-01), Stryker
patent: 4066839 (1978-01-01), Cossutta et al.
patent: 4084312 (1978-04-01), Kirk et al.
patent: 4143508 (1979-03-01), Ohno

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