Pressureless curing system for chemically cross-linking ethylene

Details Pressureless curing system for chemically cross-linking ethylene Pressureless curing system for chemically cross-linking ethylene

1970-12-18

1976-05-25

Michl, Paul R.

Stock material or miscellaneous articles

Coated or structually defined flake, particle, cell, strand,...

Rod, strand, filament or fiber

260 4214, 260 4229, 260 4242, C08K 904

Patent

active

039595587

ABSTRACT:
A curable composition comprising an ethylene-containing polymer, a curing agent, and a mineral filler treated with an organic compound selected from the group consisting of maleic anhydride, dimethyl itaconate, and acrylic acid, is compounded and fabricated to the desired shape, such as an insulation layer over a conductor. The fabricated product is then passed through a nonaqueous heat transfer medium maintained at atmospheric or ambient pressure and at a temperature sufficient to effect curing in situ of the ethylene-containing polymer. The resulting cured composition is characterized as relatively dense (substantially non-porous) especially suitable for use as insulation for wire and cable.

REFERENCES:
patent: 2888424 (1959-05-01), Precopio et al.
patent: 2930083 (1960-03-01), Vostovich et al.
patent: 3272772 (1966-09-01), Russell

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