Method and apparatus for processing a planar structure

Details Method and apparatus for processing a planar structure Method and apparatus for processing a planar structure

1997-12-12

1999-07-06

Picardat, Kevin M.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

438106, 438110, H01L 2144, H01L 2148, H01L 2150

Patent

active

059207698

ABSTRACT:
A method and apparatus are provided for handling planar structures, such as semiconductor wafers, with reduced breakage and cracking. The method includes the step of segmenting a wafer prior to grinding. The apparatus includes a segmented vacuum table for supporting wafer portions in position to be ground to a desired thickness. In another aspect of the invention, adhesive material is employed to individually secure wafer portions in position during the grinding process.

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