Fishing – trapping – and vermin destroying
Patent
1988-11-03
1989-08-08
Hearn, Brian E.
Fishing, trapping, and vermin destroying
437182, 437230, 437172, H01L 2192
Patent
active
048552518
ABSTRACT:
According to the present invention, a method is provided of manufacturing electronic parts, comprising a first step of forming on the surface of a substrate a bump wherein the metal particles of that portion of the bump which contacts the surface of the substrate have a larger diameter than the metal particles of that portion of the bump which does not contact the surface of the substrate, a second step of transferring the bump to an electrode lead, and a third step of connecting an electrode lead to a predetermined electrode section of the semiconductor chip, by means of the transferred bump. The method of the present invention ensures that the bump does not fall off during the electroplating and washing steps, and ensures a high-strength bond between the transferred bump and the electrode section of a semiconductor chip.
REFERENCES:
patent: 3621564 (1971-11-01), Tanaka et al.
patent: 4494688 (1985-01-01), Hatada et al.
H. Y. Chen, "Current Distribution During the Electrodeposition of Gold," J. Electrochem. Soc., vol. 117, No. 5, May 1970, pp. 609-614.
Hatada et al., "New Film Carrier Assembly Technology Transferred Bump Tab", Proc. IEEE 1986 Symposium, Sep. 1986, pp. 122-127.
Iwase Nobuo
Iyogi Kiyoshi
Yamakawa Koji
Hearn Brian E.
Kabushiki Kaisha Toshiba
Quach T. N.
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