Chemistry: electrical and wave energy – Processes and products
Patent
1980-09-29
1983-08-30
Tufariello, T. M.
Chemistry: electrical and wave energy
Processes and products
204203, 204224R, C25D 502, C25D 1706, C25D 1728
Patent
active
044015224
ABSTRACT:
The present invention deals with the continuous metal exchange for workpieces such as a printed circuit board which can take place in a plating tank. The workpieces are conveyorized for continuous horizontal transport into and out of a plating tank. Opposite ends of the tank are provided with slots to receive and discharge the workpieces which are sealed, in the instance illustrated, by opposed rollers or an open slot of small area to prevent leakage in excess of the pump capacity. The workpieces are suspended at their upper portion by a non-conductive hanger, the lower portion of which is rendered conductive. When the workpiece enters the plating tank the conductive portion of the hanger suspending the workpiece from the conveyor, makes contact to energize bus bars thereby converting the workpiece to a cathode (or anode if metal is to be removed). A plating solution is inside of the tank and provided with anodes or cathodes energized for metal exchange. The method is directed to conveyorizing workpieces for continuous horizontal transport, sealing the opposite ends of a tank while providing for passing the workpieces through the seal at the ends of the tank, rendering the workpieces conductive while in the tank, and providing a fluid in the tank energized for metal exchange in ultimate contact with sufficient agitation (from the spargers) at the anodes and cathodes to prevent polarization during high speed plating.
REFERENCES:
patent: 1556045 (1925-10-01), Swain
patent: 1793551 (1931-02-01), Jording
patent: 2212588 (1940-08-01), Csanyi
patent: 2490055 (1949-12-01), Hoff
Buschow Adolph G.
Eidschun Charles D.
Dominik Jack E.
Micro-Plate Inc.
Tufariello T. M.
LandOfFree
Plating method and apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Plating method and apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Plating method and apparatus will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-904865