Device for encapsulating electronic components

Plastic article or earthenware shaping or treating: apparatus – Distinct means to feed – support or manipulate preform stock... – Opposed registering coacting female molds

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249 95, 26427217, 425120, 425192R, 425256, 425572, 425588, 425DIG228, B29C 4502, B29C 4508, B29G 300

Patent

active

051587807

ABSTRACT:
A device for simultaneously encapsulating a number of electronic components is provided with a locking mechanism in which a molding cycle has two phases, i.e. in a first transfer phase, during which plungers for injecting molten resin into encapsulation cavities are locked and driven at a high, controlled speed, followed by a second curing phase, during which the plungers are spring-loaded, unlocked, and stationary, and are subject to the same maximum pressure of the transfer phase. In this way damage to the products is prevented, while the cycle time is reduced and the products obtained have an even and smooth appearance.

REFERENCES:
patent: 4347211 (1982-08-01), Bandoh
patent: 4511317 (1985-04-01), Bandoh
patent: 4655274 (1987-04-01), Dannoura
patent: 4723899 (1988-02-01), Osada
patent: 4915607 (1990-04-01), Medders et al.

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