Strain isolated integrated optic chip package

Details Strain isolated integrated optic chip package Strain isolated integrated optic chip package

1991-10-07

1993-05-25

Ullah, Akm E.

Optical waveguides

Integrated optical circuit

G02B 630

Patent

active

052147266

ABSTRACT:
A package for an IOC fabricated from an anisotropic material, such as X-cut lithium niobate or lithium tantalate, having identical thermal expansion coefficients in the X and Y directions and a different thermal expansion in the Z direction, or for an IOC fabricated from an isotropic material, such as gallium arsenide or silicon, includes an IOC enclosure having a planar mounting surface which has identical thermal expansion coefficients in the X and Y directions. The coefficients of the planar mounting surface are relatively similar to the thermal expansion coefficients of a planar surface of the IOC. A planar surface of the IOC is attached to the planar mounting surface of the package.

REFERENCES:
patent: 4871226 (1989-10-01), Courtnet et al.
patent: 5028106 (1991-07-01), Hockaday
patent: 5074630 (1991-12-01), Rodino et al.

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