Plated metallic cathode with porous copper subplating

Details Plated metallic cathode with porous copper subplating Plated metallic cathode with porous copper subplating

1978-12-04

1980-07-29

Edmundson, F. C.

Chemistry: electrical and wave energy

Processes and products

204 40, 204 43T, C25D 356, C25D 338

Patent

active

042149541

ABSTRACT:
A low overvoltage cathode is disclosed which has a metal substrate plated with a porous coating of dendritic copper which is in turn plated with a low overvoltage metal alloy. The substrate is preferably copper and the low overvoltage alloy is preferably a Ni-Mo alloy.

REFERENCES:
patent: 3291744 (1966-12-01), Hall
patent: 3926844 (1975-12-01), Benczur-Urmossy
patent: 3947331 (1976-03-01), Kinh et al.
patent: 4033837 (1977-07-01), Kuo et al.
patent: 4088547 (1978-05-01), Albertson
patent: 4098671 (1978-07-01), Westerlund
patent: 4105531 (1978-08-01), Kuo et al.
patent: 4116804 (1978-09-01), Needes
Malachowski, Zesz. Nauk. Politech. Slask. Chem., No. 65, pp. 235-236, (1973).
Higashi et al., Kinzoku Hyomen Gisyutsu, vol. 27, No. 11, 590-595, (1976).
Imanaga, Kinzoku Hyomen Gijutso, vol. 19, No. 2, 73-78, (1968).
Stasov et al., Elektrokhimiya, vol. 8, No. 9, pp. 1331-1333, 8/71.

Affiliated with

Also associated with

Rating

Plated metallic cathode with porous copper subplating does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Plated metallic cathode with porous copper subplating, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Plated metallic cathode with porous copper subplating will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-903429