Surface finishing and plating method

Chemistry: electrical and wave energy – Processes and products

Patent

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Details

204 35R, 204217, C25D 704, C25D 544

Patent

active

039590895

ABSTRACT:
This specification discloses a method and apparatus for plating a surface wherein a conductive anode body is spaced from a cathodic work surface by non-conductive particles carried in the anode body. The non-conductive particles closely space the anode from the cathodic surface, activate the cathodic surface to increase the plating rate, and may be utilized to carry out a honing or burnishing operation on the work surface.

REFERENCES:
patent: 2997437 (1961-08-01), Whitaker
patent: 3377264 (1968-04-01), Duke et al.
patent: 3616289 (1971-10-01), Ellis et al.
patent: 3619384 (1971-11-01), Eisner
patent: 3706650 (1972-12-01), Eisner
patent: 3751346 (1973-08-01), Ellis et al.

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