Process for patterning films in manufacture of integrated circui

Details Process for patterning films in manufacture of integrated circui Process for patterning films in manufacture of integrated circui

1987-10-02

1989-05-09

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437 31, 437225, 437241, 437238, 156653, 156657, 1566591, 148DIG51, H01L 21265

Patent

active

048290254

ABSTRACT:
An improved process is described for patterning films or layers, for example, in the manufacture of integrated circuit structures including bipolar and MOS devices on a silicon substrate, without damaging areas of the underlying substrate material, e.g., those portions of the substrate wherein active elements of an integrated circuit components will be formed. The process comprises patterning films or layers of dissimilar materials which respond differently to etchants to form a portion of masking materials over a selected area of an underlying substrate material and subsequently removing these masking materials using wet etching, at those steps in the process when damage to the underlying substrate material by dry etching may occur, to avoid damage to the underlying material by dry etching.

REFERENCES:
patent: 4243435 (1981-01-01), Barile
patent: 4667395 (1987-05-01), Ahlgren
patent: 4675984 (1987-06-01), Hsu
patent: 4693782 (1987-09-01), Kikuchi et al.
patent: 4735916 (1988-04-01), Homma
patent: 4780427 (1988-10-01), Sakai

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