Monitoring bond parameters during the bonding process

Details Monitoring bond parameters during the bonding process Monitoring bond parameters during the bonding process

1987-12-31

1989-08-08

Godici, Nicholas P.

Metal fusion bonding

Process

With condition responsive, program, or timing control

228103, 228110, 228 11, 228 9, 73582, 73588, B23K 2010

Patent

active

048544949

ABSTRACT:
A method of monitoring bonding parameters during a bonding process. The method is based on the object of continuous monitoring of bonding parameters in order to provide adjustment of bonding machines and thereby increase the reliability of the bonded connections. A bonding force is measured by a wire strain gauge attached to a bonding arm and an ultrasound amplitude is measured by a piezo-electric sensor secured to the bonding arm. The method can be used with all bonding machines which work with ultrasound.

REFERENCES:
patent: 3453540 (1969-07-01), Dusheck
patent: 3827619 (1974-08-01), Cusick et al.
patent: 3857279 (1974-12-01), Salzer et al.
patent: 4040885 (1977-08-01), Hight et al.
patent: 4603802 (1986-08-01), Kurtz et al.
"Ultrasonic Wire Welding" by Johnson et al, Solid State Technology, Mar. 1977, pp. 50-56.

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