Bipolar transistor by selective and lateral epitaxial overgrowth

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437 9, 148DIG26, H01L 21265

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048290165

ABSTRACT:
Silicon epitaxial lateral overgrowth (ELO) techniques are employed to fabricate bipolar transistors. ELO bipolar devices have may advantages in reducing parasitic values. Because the heavily doped buried layer (or sub-collector) is eliminated in ELO structures, C.sub.cs is greatly reduced. The concentric collector contact and its closeness to the active collector region reduce r.sub.c in the device. The parasitic collector-to-base capacitance, C.sub.cb, is also reduced due to oxide-isolation. The ELO device is fabricated using standard silicon-processing equipment. ELO can be accomplished on <100> or <111> silicon substrates.

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