Method and apparatus for dicing semiconductor substrates using a

Details Method and apparatus for dicing semiconductor substrates using a Method and apparatus for dicing semiconductor substrates using a

1991-11-13

1993-05-25

Albritton, C. L.

Electric heating

Metal heating

By arc

21912183, B23K 2600

Patent

active

052142612

ABSTRACT:
Method and apparatus for using deep ultraviolet excimer laser beams to dice semiconductor substrates, such as sapphire, with or without integrated circuitry, by establishing guided relative motion between the beam and the substrate to achieve ablative photodecomposition with the angle between the beam and the substrate being approximately five (5) degrees out of normal.

REFERENCES:
patent: 4224101 (1980-06-01), Tijburg et al.
patent: 5075201 (1991-12-01), Koh

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