Solder preform

Details Solder preform Solder preform

1979-01-10

1980-07-29

Husar, Francis S.

Metal fusion bonding

Specialized pot

Having means to treat flux or filler

428643, B23K 3526, H01L 2310

Patent

active

RE0303488

ABSTRACT:
A solder preform for hermetically sealing a cover to a container for a semiconductor package comprises a relatively thick flat ring of an alloy consisting of substantially 95% lead, 2.5% tin, and 2.5% silver, which alloy has the characteristic that it solidifies from the fluid state as a homogeneous mixture without substantial separation of the minority element crystals. The solder preform further comprises a relatively thin coating clad on each surface of the flat ring of an oxidation-resistant alloy, preferably an alloy consisting of substantially 96.5% tin and 3.5% silver.

REFERENCES:
patent: 150623 (1874-04-01), Shaw
patent: 2151302 (1939-03-01), Scheller
patent: 3305389 (1967-02-01), Lowenheim et al.
patent: 3465943 (1969-09-01), Clark et al.
patent: 3639218 (1972-02-01), Missel
"Brazing and Soldering Alloys-Part I" Mar. 27, 1962 Semi-Alloys Inc., Mt. Vernon, N.Y.

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