Method of and apparatus for mounting an IC chip

Details Method of and apparatus for mounting an IC chip Method of and apparatus for mounting an IC chip

1987-03-24

1989-03-14

Pellinen, A. D.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

29832, 357 80, H05K 720

Patent

active

048129496

ABSTRACT:
A method for mounting an integrated circuit or chip (10) on a printed circuit board (11), the chip package (36) produced thereby, and a tape carrying chips for using the method are proposed. The chip is mounted by fixing its leads (12) on the zones (13) of the board (11) by securing the chip between a support board (15) and a heat dissipating element (14) that are connected with one another by conductive columns (16) to form the package (36). The invention is applicable in particular to manufacture of very large scale integration (VSLI) chips.

REFERENCES:
patent: 3696323 (1972-10-01), Kincaid
patent: 4393581 (1983-07-01), Cherian
patent: 4396935 (1983-08-01), Schuck
patent: 4597617 (1986-07-01), Enochs
Larned et al., "IC Package Assemblies", IBM Technical Disclosure Bulletin, vol. 21, No. 5, 10/85, pp. 1517-1518.
Ehert et al., "Multichip Packaging", IBM Technical Disclosure Bulletin, vol. 14, No. 10, 3/72, p. 1.
Kilbain et al., "Printed Circuit Module Assembly", IBM Technical Disclosure Bulletin, vol. 25, No. 4, 9/82, p. 1803.

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