Modularized fabrication of high performance printed circuit boar

Details Modularized fabrication of high performance printed circuit boar Modularized fabrication of high performance printed circuit boar

1988-03-16

1989-08-08

Goldberg, Howard N.

Metal working

Method of mechanical manufacture

Electrical device making

361414, 174 685, 333238, H05K 336, H05K 114

Patent

active

048540382

ABSTRACT:
The invention features a method of fabricating a printed circuit board using a modular technique. Sub-assemblies are first constructed, tested, and then subsequently incorporated into the final circuit board assembly which has a triplate geometry. Lamination of the modular sub-assemblies minimizes dielectric core thickness.

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