Sputtering apparatus with a rotating target

Details Sputtering apparatus with a rotating target Sputtering apparatus with a rotating target

1991-08-13

1993-05-25

Weisstuch, Aaron

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

20429806, 20429811, C23C 1435

Patent

active

052136728

ABSTRACT:
An apparatus is presented, with a rotating target (18, 15), which is tubularly configured, with a stationary magnet unit (2) disposed within the tube, of a magnetron cathode, which produces a stationary plasma hose provided essentially with two long straight lines in front of the surface of the rotating target, which exercises an erosive action on the surface of the rotating target (18, 15), whereby the formation occurs of a narrowing of the diameter of the tubular rotating target (18, 15) in the middle portion of the tubular rotating target and the formation of margins at the two ends (14, 15) of the tubular rotating target be provided each with a dark-space shield (16, 17) which cover the margins of the tubular rotating target.

REFERENCES:
patent: 4362611 (1982-12-01), Logan et al.
patent: 5100527 (1992-03-01), Stevenson et al.
patent: 5108574 (1992-04-01), Kirs et al.

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