Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1997-04-14
1999-07-06
Stephan, Steven L.
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
439526, 439 66, H01R 909
Patent
active
059190507
ABSTRACT:
A socket connects electronic components such as integrated circuit modules with arrays of solder balls or columns, lands, pads of similar contacts to other components, typically substrates such as printed circuit boards. The socket has a polarization post and locator posts that extend through polarization and locator holes in the substrate and in a registration sheet that locates the module with respect to the substrate. The heads of the posts, which are all substantially the same size, extend through arcuate slots in a cam ring. Each of the slots has an inclined ramp that engages the heads of the post. When the cam ring is turned, the heads of the posts ride up the ramps, moving the cam ring towards the substrate and compressing a wave spring that presses against a pressure plate. The pressure plate in turn presses the module toward the substrate, providing a secure yet separable electrical connection between the contacts in the array on the module and contacts on the substrate, preferably through an electrical interposer positioned between the module and the substrate.
REFERENCES:
patent: 4164003 (1979-08-01), Cutchaw
patent: 4376560 (1983-03-01), Olsson et al.
patent: 4554505 (1985-11-01), Zachry
patent: 4830623 (1989-05-01), Owens et al.
patent: 4832612 (1989-05-01), Grabbe et al.
patent: 4933808 (1990-06-01), Horton et al.
patent: 4943242 (1990-07-01), Frankeny et al.
patent: 5037311 (1991-08-01), Frankeny et al.
patent: 5099393 (1992-03-01), Bentlage et al.
patent: 5163834 (1992-11-01), Chapin et al.
patent: 5248262 (1993-09-01), Busacco et al.
patent: 5262925 (1993-11-01), Matta et al.
patent: 5397245 (1995-03-01), Roebuck et al.
patent: 5413489 (1995-05-01), Switky
patent: 5426405 (1995-06-01), Miller et al.
patent: 5468158 (1995-11-01), Roebuck et al.
patent: 5653600 (1997-08-01), Ollivier
patent: 5730620 (1998-03-01), Chan et al.
DieMate from Texas Instruments A Bare Die Burn-in & Test Interconnect System--Texas Instruments 1994.
IBM Microelectronics CBeam.TM. Connector 1995.
Kehley Glenn Lee
Myrto Glenn Edward
Sherman John Henry
International Business Machines - Corporation
Patel T C
Stephan Steven L.
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