Method for manufacturing field effect transistors

Metal working – Method of mechanical manufacture – Assembling or joining

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29576B, 29578, 148187, H01L 21265, H01L 2128

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active

044425899

ABSTRACT:
A transistor and method of forming the same are disclosed. A thick mesa of dielectric material is grown on a semiconductor substrate and two or more layers of polycrystalline silicon grown on the vertical sides of the mesa serve a masking function to define the gate region of the transistor with high accuracy. The mesa and the two or more polycrystalline layers remain in the final device.

REFERENCES:
patent: 3846822 (1974-11-01), Riley et al.
patent: 4033026 (1977-07-01), Pashley
patent: 4038107 (1977-07-01), Marr et al.
patent: 4074300 (1978-02-01), Sakai et al.
patent: 4078947 (1978-03-01), Johnson et al.
patent: 4079504 (1978-03-01), Kosa
patent: 4099987 (1978-07-01), Jambotkar
patent: 4101922 (1978-07-01), Tihanyi et al.
patent: 4173818 (1979-11-01), Bassous et al.
patent: 4209349 (1980-06-01), Ho et al.
patent: 4234362 (1980-11-01), Riseman
patent: 4272881 (1981-06-01), Angle
patent: 4296426 (1981-10-01), Gilles
patent: 4312680 (1982-01-01), Hsu
patent: 4342149 (1982-08-01), Jacobs et al.
IBM Technical Disclosure Bulletin, vol. 19, No. 4, Sep. 1976, pp. 1162 and 1163.
IBM Technical Disclosure Bulletin vol. 21, No. 12, May 1979, pp. 5035-5038.

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