Electroplating system

Details Electroplating system Electroplating system

1987-06-08

1988-11-01

Valentine, Donald R.

Chemistry: electrical and wave energy

Processes and products

Electrostatic field or electrical discharge

204232, 204240, 204DIG13, C02F 146, C25D 2108

Patent

active

047818069

ABSTRACT:
An electroplating system with improved water use efficiency and unique waste water treatment which enables operation without access to public sewers thereby permitting compliance with governmental regulations regarding disposal of waste water. Water use efficiency is achieved by means of limited use of overhead water sprays, multiple rinse tank backflow to the prior process tank and water evaporation from said process tanks. In addition, all waste water not returned to the prior process tank locally at each plating subassembly is transferred to an inplant sump for common evaporative treatment.

REFERENCES:
patent: 3640331 (1972-02-01), Yagishita
patent: 3658470 (1972-04-01), Zievers et al.
patent: 3661732 (1972-05-01), Withrow
patent: 3826718 (1974-07-01), Takayasu
patent: 3973987 (1976-08-01), Hewitt
patent: 3979220 (1976-09-01), Ishiyama et al.
patent: 4157942 (1979-06-01), Tuznik et al.
patent: 4561956 (1985-12-01), Antonelli
patent: 4592819 (1986-06-01), Suzuki et al.
patent: 4595474 (1986-06-01), Greco
patent: 4613412 (1986-09-01), MacDermid

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