Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent
1996-07-01
1998-11-17
Whitehead, Jr., Carl W.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
257712, 257718, 361703, 361697, 361707, H01L 2334, H05K 720
Patent
active
058380655
ABSTRACT:
In order to provide a thermal coupling between a heat source and a heat sink, an integrated interleaved-fin connector is provided. A first substrate includes a first side surface and a second side surface. A plurality of heat generating devices are formed in the first side surface. A plurality of first channels are etched in the second side surface to form a plurality of first fins. A second substrate has a plurality of second channels etched therein to form a plurality of second fins and a base. The base is for thermally engaging with a heat sink. The first and second fins providing a thermally conductive path from the heat generating devices to the heat sink when interleaved with each other.
REFERENCES:
patent: 4800596 (1989-01-01), Hamburgen
patent: 5083373 (1992-01-01), Hamburgen
IEEE, 1991.COPYRGT., 0569-5503/91/0000-0693, "Hardware Technology for Hitachi M-880 Processor Group," F. Kobayashi, Y. Wtanabe, M. Yamamato, A. 41st Electronic Components & Technology Conference, Atlanta, Georgia!.
"Interleaved Fin Thermal Connectors for Multichip Modules," WRL Research Report 91/9, Aug. 1991, William R. Hamburgen; Digital Equipment Corp., Western Research Lab, 250 University Ave., California 94301 USA.
Fitch John S.
Hamburgen William R.
Digital Equipment Corporation
Whitehead Jr. Carl W.
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