Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent
1995-04-19
1998-11-17
Arroyo, Teresa M.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
257706, 257720, 257712, 361709, 361711, 361720, H01L 2310, H01L 2334
Patent
active
058380647
ABSTRACT:
An electronic package includes a supporting member, an electronic device, a carrier, a substrate a cooling means. The supporting member includes a plate and a bottom leg for supporting the plate. A first end of the bottom leg is joined to the lower surface of the plate. The carrier has a hole for receiving the bottom leg. The electronic device is connected to the carrier and is attached to the lower surface of the plate. A second end of the bottom leg is inserted into the hole of the carrier. The second end of the bottom leg is joined to the upper surface of the substrate. The electronic device is positioned between the plate of the supporting member and the substrate. The cooling is attached onto and supported by the upper surface of the plate.
REFERENCES:
patent: 4446504 (1984-05-01), Jordan et al.
patent: 4853828 (1989-08-01), Penn
patent: 5296739 (1994-03-01), Hielbronner et al.
patent: 5424919 (1995-06-01), Hielbronner
patent: 5442234 (1995-08-01), Liang
Shimada Yuzo
Suyama Takayuki
Tanaka Yoshimasa
Arroyo Teresa M.
NEC Corporation
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