Structure for temperature detection in a package

Details Structure for temperature detection in a package Structure for temperature detection in a package

1989-08-23

1990-12-04

Hille, Rolf

357 80, 357 82, H01L 2302

Patent

active

049757660

ABSTRACT:
A structure for detecting a temperature of a package which includes a circuit board having mounted thereon a plurality of integrated circuit chips, each of which is accommodated in a chip carrier, a cooling plate facing the integrated circuit chips for performing a heat exchanger with a coolant, a temperature sensing block including a case which is mounted on the circuit board and has substantially the same height as the chip carriers with at least one temperature sensor accommodated in the case, and a heat-conducting medium filling small clearances defined between the cold plate and the integrated circuit chips and the temperature sensing block.

REFERENCES:
patent: 2357706 (1944-09-01), Toepperwein
patent: 2783418 (1957-02-01), Peter et al.
patent: 2999034 (1961-09-01), Heidenhain
patent: 3205469 (1965-09-01), Frank et al.
patent: 3211969 (1965-10-01), Colaiaco
patent: 3651865 (1972-03-01), Feldmanis
patent: 3777220 (1973-12-01), Tatusko et al.
patent: 3827457 (1974-08-01), Vutz et al.
patent: 3881181 (1975-04-01), Khajezadeh
patent: 3908188 (1975-09-01), Kawamoto
patent: 3912001 (1975-10-01), Missman et al.
patent: 3993123 (1976-11-01), Chu et al.
patent: 4037270 (1977-07-01), Ahmann et al.
patent: 4093971 (1978-06-01), Chu et al.
patent: 4109707 (1978-08-01), Wilson
patent: 4110549 (1978-08-01), Goetzke et al.
patent: 4115836 (1978-09-01), Hutchison et al.
patent: 4158875 (1979-06-01), Tajima et al.
patent: 4196775 (1980-04-01), Groh
patent: 4204246 (1980-05-01), Arii et al.
patent: 4245273 (1981-01-01), Feinberg et al.
patent: 4282924 (1981-08-01), Faretra
patent: 4381032 (1983-04-01), Cutchaw
patent: 4398208 (1983-08-01), Murano et al.
patent: 4439918 (1984-04-01), Carroll et al.
patent: 4467522 (1984-08-01), Marchisi
patent: 4468717 (1984-08-01), Mathias et al.
patent: 4493010 (1985-01-01), Morrison et al.
patent: 4498122 (1985-02-01), Rainal
patent: 4509096 (1985-04-01), Baldwin et al.
patent: 4535385 (1985-08-01), August et al.
patent: 4536824 (1985-08-01), Barrett et al.
patent: 4546410 (1985-10-01), Kaufman
patent: 4574879 (1986-03-01), DeGree et al.
patent: 4588023 (1986-05-01), Munekawa
patent: 4602125 (1986-07-01), West et al.
patent: 4602678 (1986-07-01), Fick
patent: 4628990 (1986-12-01), Hagihara et al.
patent: 4641176 (1987-02-01), Keryhuel et al.
patent: 4644385 (1987-02-01), Nakanishi et al.
patent: 4666545 (1987-05-01), DeGree et al.
patent: 4685211 (1987-08-01), Hagihara et al.
patent: 4686606 (1987-08-01), Yamada et al.
patent: 4689659 (1987-08-01), Watanabe
patent: 4712158 (1987-12-01), Kikuchi et al.
patent: 4721996 (1988-01-01), Tustaniwskyj et al.
patent: 4724611 (1988-02-01), Hagihara
patent: 4727554 (1988-02-01), Watanabe
patent: 4729424 (1988-03-01), Mizuno et al.
patent: 4744007 (1988-05-01), Watari et al.
patent: 4748495 (1988-05-01), Kucharek
patent: 4750086 (1988-06-01), Mittal
patent: 4768352 (1988-09-01), Maruyama
patent: 4781244 (1988-11-01), Kuramitsu et al.
patent: 4783721 (1988-11-01), Yamamoto et al.
patent: 4791983 (1988-12-01), Nicol et al.
patent: 4794981 (1989-01-01), Mizuno
patent: 4884167 (1989-11-01), Mine
"Module Package", Dion et al., IBM Technical Disclosure Bulletin, vol. 7, No. 7, (1 page) (Dec. 1964).
IBM Technical Disclosure Bulletin, vol. 20, No. 11A, Apr. 1978, "Three-Dimensional MLC Substrate Integrated Circuit Support Package", Aichelmann et al., pp. 4349 and 4350.
IBM Technical Disclosure Bulletin, vol. 20, No. 11A, Apr. 1978, "Conduction-Cooling Module", Hwang et al., pp. 4334-4335.
IBM Technical Disclosure Bulletin, vol. 21, No. 6, (Nov. 1978), "Compliant Cold Plate Cooling Scheme", Antonetti et al., p. 2431.
IBM Technical Disclosure Bulletin, vol. 21, No. 6, Nov. 1978, "Solid Encapsulated Module", Chu et al., pp. 2435-2436.
Forward and Introduction of IEEE International Conference on Computer Design: VLSI in Computers; ICCD '83 Session: The New IBM 4381, 3 pages (Nov. 1, 1983).
IBM J. Res. Develop., vol. 26, No. 1, pp. 55-66, (Jan. 1982), "A Conduction-Cooled Module for High-Performance LSI Devices", Oktay, et al.
Electronics, "Supercomputers Demand Innovation in Packaging and Cooling", Lyman, pp. 136-144, Sep. 22, 1982.
IBM Technical Disclosure Bulletin, "Counter-Flow Cooling System", Chu, vol. 8, No. 11, Apr. 1966, p. 1692.
IBM Technical Disclosure Bulletin, vol. 18, No. 12, pp. 3982-3983, "Heat-Pipe Cooled Stacked Electronic Wafer Package", Kerjilian et al., May 1976.
IBM Technical Disclosure Bulletin, vol. 20, No. 4, Sep. 1977, "Method of Effective Cooling of a High Power Silicon Chip", Doo et al., pp. 1436-1437.
Microelectronics, Scientific American, published 1977 by W. H. Freemand and Company, San Francisco, cover page, pp. 51, 166.
Assembly Techniques, pp. 404-420, understood to be from the book Integrated Circuit Engineering, publishing date not known.
IEEE Transactions on Components, Hybrids and Manufacturing Technology, vol. CHMT-2, No. 3, Sep. 1977, "Bumped Tape Automated Bonding (BTAB) Practical Application Guidelines", Kanz et al., pp. 301-308.
IEEE Transactions on Components, Hybrids, and Manufacturing Tech., vol. CHMT-3, No. 1, Mar. 1980, "IBM Multichip Multilayer Ceramic Modules for LSI Chips--Design for Performance and Density", Clark, et al., pp. 89-93.
IEEE International Conference on Computer Design: VLSI in Computers ICCD '83 Session: The New IBM 4381, "New Internal and External Cooling Enhancements for the Air-Cooled IBM 4381 Module", Oktay et al., 4 pages (Nov. 1, 1983).
IEEE International Conference on Computer Design: VLSI in Computers ICCD '83 Session: The New IBM 4381, "Electrical Design and Analysis of the Air-Cooled Module (ACM) in IBM System/4381", Cherensky et al., 6 pages (Nov. 1, 1983).
IEEE International Conference on Computer Design: VLSI in Computers ICCD '83 Session: The New IBM 4381, "Hermetic Tin/Lead Solder Sealing for the Air-Cooled IBM 4381 Module", Brady et al., 4 pages (Nov. 1, 1983).

Affiliated with

Also associated with

Rating

Structure for temperature detection in a package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Structure for temperature detection in a package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Structure for temperature detection in a package will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-886511