Process enhancement using molybdenum plugs in fabricating integr

Fishing – trapping – and vermin destroying

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437192, 437918, 437 47, 437190, 148DIG136, H01L 2170

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active

049753860

ABSTRACT:
A method of interconnecting circuit components in a semiconductor integrated circuit including component elements formed in the substrate and thin-film resistors and capacitors formed on a surface of the substrate, a molybdenum plug is utilized to facilitate stable, uniform low resistance contacts to circuit elements, molybdenum (moly) plugs are utilized as a barrier between interconnect metallization and the circuit components. A CLAD moly/aluminum metallization interconnect can be fabricated in a standard process in which the moly plugs are formed. The accuracy and stability of thin-film resistors is facilitated during wafer processing, laser trimming, temperature cycling, and assembly processing thereby providing repeatable matching by eliminating contact resistance as a process variable.

REFERENCES:
patent: 3649945 (1972-03-01), Waits
patent: 3996551 (1976-12-01), Croson
patent: 4569122 (1986-02-01), Chan
patent: 4581815 (1986-04-01), Cheung et al.
patent: 4582563 (1986-04-01), Hazuki et al.
patent: 4755480 (1988-07-01), Yau et al.
patent: 4884123 (1989-11-01), Dixit et al.
patent: 4898838 (1990-02-01), Morris et al.
patent: 4906593 (1990-03-01), Shioya et al.

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