Projected contact structure for bumped semiconductor device and

Details Projected contact structure for bumped semiconductor device and Projected contact structure for bumped semiconductor device and

1997-03-26

1999-07-27

Williams, Alexander Oscar

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

257738, 257780, 257778, 257692, H01L 2348, H01L 2946, H01L 2352

Patent

active

059295210

ABSTRACT:
A bumped semiconductor device contact structure is disclosed including at least one non-planar contact pad having a plurality of projections extending therefrom for contacting at least one solder ball of a bumped integrated circuit (IC) device, such as a bumped die and a bumped packaged IC device. The projections are arranged to make electrical contact with the solder balls of a bumped IC device without substantially deforming the solder ball. Accordingly, reflow of solder balls to reform the solder balls is not necessary with the contact pad of the present invention. Such a contact pad may be provided on various testing equipment such as probes and the like and may be used for both temporary and permanent connections. Also disclosed is an improved method of forming the contact pads by etching and deposition.

REFERENCES:
patent: Re27934 (1974-03-01), Merrin et al.
patent: 3202888 (1965-08-01), Evander
patent: 4263606 (1981-04-01), Yorikane
patent: 4390771 (1983-06-01), Kurtz et al.
patent: 4597519 (1986-07-01), Kurtz et al.
patent: 4804132 (1989-02-01), DiFrancesco
patent: 5207585 (1993-05-01), Byrnes et al.
patent: 5214308 (1993-05-01), Nishiguchi et al.
patent: 5329423 (1994-07-01), Schulz
patent: 5373111 (1994-12-01), McClure et al.
patent: 5426266 (1995-06-01), Brown et al.
patent: 5428298 (1995-06-01), Ko
patent: 5457344 (1995-10-01), Bartelink
patent: 5508561 (1996-04-01), Tago et al.
patent: 5532613 (1996-07-01), Nagasawa et al.
patent: 5545589 (1996-08-01), Tomura et al.
patent: 5545920 (1996-08-01), Russell
patent: 5550083 (1996-08-01), Koide et al.
patent: 5559054 (1996-09-01), Adamjee
patent: 5559366 (1996-09-01), Fogal et al.
patent: 5585282 (1996-12-01), Wood et al.
patent: 5592736 (1997-01-01), Akram et al.
patent: 5656858 (1997-08-01), Kondo et al.
patent: 5726501 (1998-03-01), Matsubara
patent: 5726502 (1998-03-01), Beddingfield
patent: 5736790 (1998-04-01), Iyogi et al.
patent: 5783865 (1998-07-01), Higashiguchi et al.
patent: 5783870 (1998-07-01), Mostafazadeh et al.
patent: 5801449 (1998-09-01), Dehaine et al.

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