Circuit with small package for mosfets

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices

Patent

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Details

257678, 257723, 257691, H01L 2334, H01L 2352, H01L 2382

Patent

active

059295201

ABSTRACT:
A circuit with a small package for MOSFETs comprises a load circuit in which an a.c. current flows. Further included are a p-channel enhancement-mode MOSFET and an n-channel enhancement-mode MOSFET, the sources of which are connected together at a common node through which the a.c. current flows. The MOSFETs respectively provide positive-going and negative-going contributions to the a.c. current, with approximately equal r.m.s. values. A package is provided in which the MOSFETs are arranged adjacent to each other, in the same plane. A main surface of the package has an area of no more than about 40.5 square millimeters. The channel area of the p-channel MOSFET is from about 1.4 to about 2.0 times the channel area of the n-channel MOSFET.

REFERENCES:
patent: 5489804 (1996-02-01), Pasch
patent: 5585600 (1996-12-01), Froebel et al.
patent: 5585668 (1996-12-01), Burns
patent: 5598031 (1997-01-01), Groover et al.
patent: 5629542 (1997-05-01), Sakamoto et al.
patent: 5637913 (1997-06-01), Kajihara et al.
patent: 5646829 (1997-07-01), Sota
patent: 5648683 (1997-07-01), Takahashi
patent: 5814884 (1998-09-01), Davis et al.
patent: 5821618 (1998-10-01), Graf et al.
(Anonynous), "Little Foot Surface-Mount Power Mosfets Featured Products," Siliconix Inc., Santa Clara, California, Feb. 1997, title page, pp. iv, v, 5-10 and 5-11.
Nerone, "Acknowledgement of Background Art," Louis R. Nerone (applicant).

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