Aqueous acidic bath for electrochemical deposition of a shiny an

Details Aqueous acidic bath for electrochemical deposition of a shiny an Aqueous acidic bath for electrochemical deposition of a shiny an

1989-10-24

1990-12-04

Kaplan, G. L.

Chemistry: electrical and wave energy

Processes and products

204 521, C25D 338

Patent

active

049751590

ABSTRACT:
The aqueous acidic bath for electrochemical deposition of a shiny and tear-free copper coating, especially for reinforcement of conductive pathways of a printed circuit with outstanding breaking elongation, contains at least one copper salt, at least one inorganic acid and at least one alkoxylated lactam as an amide-group-containing compound. The aqueous acidic bath also includes, as necessary, a compound having a chloride ion, a sulfur-containing organic compound with a solubilizing group and another organic compound selected from a group including polyglycols defined in more detail hereinbelow in Table III.

REFERENCES:
patent: 3294578 (1966-12-01), Popeck
patent: 4336114 (1982-06-01), Mayer et al.
patent: 4781801 (1988-11-01), Frisby

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