Chemistry: electrical and wave energy – Processes and products
Patent
1983-01-24
1984-08-28
Niebling, John F.
Chemistry: electrical and wave energy
Processes and products
156151, 428612, 428675, 428687, 204140, 204DIG9, C25D 510, C25D 1100
Patent
active
044682930
ABSTRACT:
A process and apparatus for treating a metal foil to enhance its ability to be bonded to a substrate comprise immersing the metal foil in an electrolytic cell having an electrolyte bath solution containing copper and applying a current having regularly recurring pulses and preferably flowing in only one direction to the cell. The current causes a dendritic layer of copper to be deposited on at least one surface of the metal foil at a first current density and bonded thereto at a second current density. The process and apparatus are particularly suited for treating copper foil.
REFERENCES:
patent: Re30180 (1979-12-01), Wolski et al.
patent: 3220897 (1965-11-01), Conley et al.
patent: 3227637 (1966-01-01), De Hart
patent: 3293109 (1966-12-01), Luce et al.
patent: 3322656 (1967-05-01), Dahringer et al.
patent: 3328275 (1967-06-01), Waterbury
patent: 3454376 (1969-07-01), Luce et al.
patent: 3518168 (1970-06-01), Byler et al.
patent: 3585010 (1971-06-01), Luce et al.
patent: 3674656 (1972-07-01), Yates
patent: 3699018 (1972-10-01), Carlson
patent: 3799847 (1974-03-01), Vladimirovna et al.
patent: 3857681 (1974-12-01), Yates et al.
patent: 3857766 (1974-12-01), Woods
patent: 3918926 (1975-11-01), Wolski et al.
patent: 3959088 (1976-05-01), Sullivan
patent: 4010005 (1977-03-01), Morisaki et al.
patent: 4049481 (1977-09-01), Morisaki
patent: 4061837 (1977-12-01), Hutkin
patent: 4082591 (1978-04-01), Morisaki et al.
patent: 4140599 (1979-02-01), Yamasaki et al.
patent: 4169018 (1979-09-01), Berdan et al.
"Periodic Reverse Current Process in Electroplating Using Acid Copper Electrolytes" by J. Mann, Transactions of the Institute of Metal Finishing, 1978, vol. 56, pp. 70-74.
"Electroplating with Current Pulses in the Microsecond Range" by V. A. Lamb, Plating, vol. 56, No. 8, Aug., 1969, pp. 909-913.
"Electroplating", by Lowenheim, McGraw-Hill Book Company, 1978, pp. 160-163.
Chao Chung-Yao
Polan Ned W.
Cohn Howard M.
Kelmachter Barry L.
Niebling John F.
Olin Corporation
Weinstein Paul
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