Electrical circuit assemblies

Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor

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339 17CF, 339 17M, 339112R, 339147R, 361394, H02B 100, H05K 720, H01R 1300

Patent

active

045204276

ABSTRACT:
In an electrical circuit assembly a stack of modules is secured in a bore through a casing, there are longitudinally extending grooves in the internal surface of the casing, and electrical interconnections each have a part both extending from a module and protruding into a groove, and a part in the groove. The electrical interconnections, the constituent electrical interconnection parts, if initially separable, and possible insulating members in the grooves between some electrical interconnections, are secured, and required electrical connections are made, by these circuit assembly parts being clamped together in the grooves. The stack may be clamped in the bore. The clamping means may include end covers for the grooves and/or for the casing bore, and the end covers may be in resilient engagement with, respectively, the electrical interconnections, and/or the module stack.

REFERENCES:
patent: 2774014 (1956-12-01), Henry, Jr.
patent: 3209208 (1965-09-01), Francis et al.
patent: 3596140 (1971-07-01), Walsh
patent: 3942854 (1976-03-01), Klein et al.
patent: 3999105 (1976-12-01), Archey et al.
"New Wafer Modules . . . for Versatile Telemetering Systems", Electronic Design, Dec. 9, 1959, pp. 58-59.
L. F. Miller, "Stacked Wafer Package", IBM Technical Disclosure Bulletin, vol. 16, No. 2, Jul. 1973, p. 627.

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