Multi-substrate radio-frequency circuit

Communications: radio wave antennas – Antennas – With coupling network or impedance in the leadin

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

343853, 333247, 257728, H01Q 138, H04B 138

Patent

active

060023759

ABSTRACT:
A radio-frequency circuit (20) includes a hybrid integrated circuit (24) having a passive circuit element (38) and a d-c biasing circuit element (54) embedded within a first substrate (32) of a low cost and rugged first semiconducting material, and first and second active circuit elements (36, 40) embedded within second and third substrates (44, 46), respectively, of a second semiconductor material having the characterisitics of greater frangibility but higher gain than the first semiconductor material. The first and second activ circuit elements (36, 40) are substantially first and second single components (36, 40), and are each electrically coupled to the passive circuit element (38). The d-c biasing circuit element (54) is electrically coupled to the first and second active circuit elements (36, 40). The second and third substrates (44, 46) are physically coupled to the first substrate (32), which is thicker than either the second or third substrate (44, 46).

REFERENCES:
patent: 4423388 (1983-12-01), Crescenzi et al.
patent: 4490721 (1984-12-01), Stockton et al.
patent: 4782381 (1988-11-01), Ruby et al.
patent: 4823136 (1989-04-01), Nathanson et al.
patent: 5063177 (1991-11-01), Geller et al.
patent: 5376942 (1994-12-01), Shiga
patent: 5391917 (1995-02-01), Gilmour et al.
patent: 5404581 (1995-04-01), Honjo
patent: 5426319 (1995-06-01), Notani
patent: 5611008 (1997-03-01), Yap
patent: 5612556 (1997-03-01), Malhi et al.
patent: 5614740 (1997-03-01), Gardner et al.
patent: 5781162 (1998-07-01), Peterson et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Multi-substrate radio-frequency circuit does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multi-substrate radio-frequency circuit, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multi-substrate radio-frequency circuit will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-867673

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.