Flat package for integrated circuit devices

Details Flat package for integrated circuit devices Flat package for integrated circuit devices

1979-08-24

1981-04-28

James, Andrew J.

Electricity: conductors and insulators

Feedthrough or bushing

Compression

357 72, 357 75, 357 80, 174 52PE, 174 52S, 174 52FP, 29588, H01L 2302, H01L 2312, H01L 2316

Patent

active

042649170

ABSTRACT:
According to the present invention, a flat package for at least one integed circuit device having output pads comprises a supporting member for the IC device, a plurality of output terminals external to the package, an array of conductors connecting the said output terminals to the said output pads of the device, and a protective means. The supporting member is a wafer and the output terminals of the package are contact islands arranged on the said wafer. At least those conductors belonging to the array which are attached to the said contact islands rest on the said supporting wafer, and the protective means comprises an electrically insulating encapsulation which partly covers the supporting wafer and which leaves exposed at least the contact islands.

REFERENCES:
patent: 3777220 (1973-12-01), Tatusko
patent: 3832769 (1974-09-01), Olyphant
patent: 3868724 (1975-02-01), Perrino
patent: 3886581 (1975-05-01), Katsumura et al.
IBM Technical Bulletin by Iafrate, vol. 15, No. 4, Sep. 1972, p. 128.

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