Method of stacking electronic components

Details Method of stacking electronic components Method of stacking electronic components

1996-10-21

1999-07-27

Young, Lee W.

Metal working

Method of mechanical manufacture

Electrical device making

29840, 29842, 29829, 174261, 257738, 361772, 361776, 439 66, H01R 906

Patent

active

059269510

ABSTRACT:
A method of stacking electronic components is disclosed. A first electronic component having a first interconnection substrate with a first set of contact pads on at least one surface thereof is provided. At least a first semiconductor device with resilient contact structures mounted thereto is provided. The first semiconductor device is positioned relative to the first electronic component with the resilient contact structures extending therefrom and electrically contacting the first set of contact pads of the first interconnection substrate.

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patent: 4893172 (1990-01-01), Matsumoto et al.
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patent: 5294039 (1994-03-01), Pai et al.
patent: 5495667 (1996-03-01), Farnworth et al.
"Method of Testing Chips and Joining Chips to Substrates" Research Disclosure, No. 322, Feb. 1, 1991, p. 130, XP000169195.
"Bimetal VLSI Chip Interconnections" IBM Technical Disclosure Bulletin, vol. 29, No. 11, Apr. 1987, pp. 5021-5022, XP002040446.

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