Method for making field effect devices and capacitors with impro

Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching

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438778, H01L 2100, H01L 213065

Patent

active

060017414

ABSTRACT:
An electronic device is formed by depositing a thin film of high dielectric constant material on a silicon substrate, exposing the structure to plasma, and then forming the top electrode. The plasma substantially reduces the density of charge traps at the dielectric/silicon interface. Advantageously, the dielectric film is passivated with a nitrogen-containing material before forming the top electrode to prevent interdiffusion between the electrode and the dielectric.

REFERENCES:
patent: 4762728 (1988-08-01), Keyser et al.
patent: 5337207 (1994-08-01), Jones et al.
patent: 5442585 (1995-08-01), Eguchi et al.

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