Hermetic leadless semiconductor device package

Details Hermetic leadless semiconductor device package Hermetic leadless semiconductor device package

1988-01-25

1989-11-07

James, Andrew J.

357 74, 357 68, H01L 2342

Patent

active

048795895

ABSTRACT:
An hermetic leadless package for a planar p-n, Schottky or other diode has a planar base and cover made of electrically conductive metal in order to serve as the contacts of the diode necessary to connect it to a circuit. A spacing frame constructed from dielectric material, such as alumina, separates the base and cover and provides a cavity for receiving a diode connected electrically to the cover by welding the short end of a J-shaped contact to the cover, and soldering the long end of the contact to one side of the diode chip. The other side of the diode chip is soldered to the base. The package is stacked for soldering by placing a sheet of preformed solder over the base, placing the spacing frame over the solder sheet, and placing a ring of preformed solder over the spacing frame. Once the diode chip is affixed to the cover, the cover is placed over the stack with the diode chip in the cavity created by the spacing frame. The stack is then placed in a graphite boat, which in turn is placed in an evacuated oven. Voidless soldering is then achieved by electrical resistive heating of the boat to a temperature necessary to melt the solder preforms.

REFERENCES:
patent: 4021839 (1977-05-01), Denlinger

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