Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Thermally responsive
Patent
1997-03-24
1999-01-05
Picardat, Kevin M.
Semiconductor device manufacturing: process
Making device or circuit responsive to nonelectrical signal
Thermally responsive
438 54, H01L 2100
Patent
active
058562109
ABSTRACT:
A method for fabricating a thermoelectric module with thermoelectric elements installed in an gapless eggcrate. This gapless eggcrate provides insulated spaces for a large number of p-type and n-type thermoelectric elements. The absence of gaps in the walls of the spaces virtually eliminates the possibility of interwall shorts between the elements. Thermoelectric elements, both p-type and n-type, are inserted into the insulated spaces in the gapless eggcrate to provide the desired thermoelectric effects . Electrical connections are established on both the hot and cold sides of the module to connect the thermoelectric elements in series or parallel as desired. Normally, most or all of the elements will be connected in series. In a preferred embodiment the gapless eggcrate is formed from a high temperature plastic. P-type thermoelectric material is extruded and then sliced to form p-type thermoelectric elements, and n-type thermoelectric material is extruded and sliced to form n-type thermoelectric elements. The thermoelectric elements are loaded in the eggcrate in an arrangement to put them all in series when a metal spray is applied to the hot and cold sides. Two electrical leads are applied and electrical connections on both the hot and cold sides are provided using a metal thermal spray technique. A thin layer of molybdenum is sprayed on one of the surfaces and then a coating of aluminum is sprayed over the molybdenum. These steps are repeated for the other side. Then the surfaces are ground down to expose the insulating eggcrate walls except where connections between the elements are desired. A seal is then applied over both the hot and cold surfaces. The seal preferably is very thin electrically insulating layer and over this layer a layer of aluminum is provided.
REFERENCES:
patent: 3509620 (1970-05-01), Phillips
patent: 3958324 (1976-05-01), Alais et al.
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patent: 4493939 (1985-01-01), Blaske et al.
patent: 4983225 (1991-01-01), Rowe
patent: 5416046 (1995-05-01), Wang
Bass John C.
Elsner Norbert B.
Leavitt Fredrick A
Hi-Z Technology, Inc.
Picardat Kevin M.
Ross John R.
Ross III John R.
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