Methods for plating semiconductor workpieces using a workpiece-e

Details Methods for plating semiconductor workpieces using a workpiece-e Methods for plating semiconductor workpieces using a workpiece-e

1997-09-30

1999-12-14

Gorgos, Kathryn

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Coating selected area

205143, 205291, C25D 502, C25D 1706, C25D 712

Patent

active

06001234&

ABSTRACT:
Methods used in semiconductor electroplating systems, such as for plating copper, onto a semiconductor wafer or other semiconductor workpiece. The methods apply to patterned metal layers plated onto a seed layer which is partially protected by an overlying photoresist or other coating. The methods employ an electrode assembly which has a boot which seals about a contact face of the electrode. The sealing is performed by engaging the seal against photoresist to prevent corrosion of the seal layer. The area enclosed by the sealing includes a via which is surrounded by the seal. The electrode contact extends through the via to provide electrical contact with the metallic seed layer. Plating of copper or other metal proceeds at exposed seed layer areas.

REFERENCES:
patent: 4192729 (1980-03-01), Cancelleri et al.
patent: 5024746 (1991-06-01), Stierman et al.
patent: 5078852 (1992-01-01), Yee et al.
patent: 5167792 (1992-12-01), Kamitakahara et al.
patent: 5168886 (1992-12-01), Thompson et al.
patent: 5168887 (1992-12-01), Thompson et al.
patent: 5228967 (1993-07-01), Crites et al.
patent: 5232511 (1993-08-01), Bergman
patent: 5235995 (1993-08-01), Bergman et al.
patent: 5238500 (1993-08-01), Bergman
patent: 5258047 (1993-11-01), Tokisue et al.
patent: 5332445 (1994-07-01), Bergman
patent: 5342495 (1994-08-01), Tung et al.
patent: 5405518 (1995-04-01), Hsieh et al.
patent: 5431421 (1995-07-01), Thompson et al.
patent: 5445172 (1995-08-01), Thompson et al.
patent: 5447615 (1995-09-01), Ishida
patent: 5500081 (1996-03-01), Bergman
patent: 5522975 (1996-06-01), Andricacos et al.

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