Method of producing a tag device with IC capacitively coupled to

Details Method of producing a tag device with IC capacitively coupled to Method of producing a tag device with IC capacitively coupled to

1998-04-21

1999-12-14

Mayes, Curtis

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156292, 156300, 235492, B32B 3104, G06K 1906

Patent

active

060012110

ABSTRACT:
A tag device and a method of producing it are disclosed. The tag device has an IC (Integrated Circuit) device, electrode plates included in the IC device, an electrically insulating film covering the electrode plates, antenna terminals each facing one of the electrode plates with the intermediary of an electrically insulating film, antennas each being connected to one of the antenna terminals, and packings. The tag device is highly durable and reliable and can be produced by a simple procedure.

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