Coating apparatus – Gas or vapor deposition – With treating means
Patent
1997-02-07
1999-01-05
Kunemund, Robert M.
Coating apparatus
Gas or vapor deposition
With treating means
118726, 20429804, C23C 1600
Patent
active
058556834
ABSTRACT:
An improved thin film deposition apparatus which is capable of easily increasing the temperature of a crucible using low electric power, for thus reducing the maintenance cost of the system, and fabricating a thin film having a constant characteristic by using a lower current density variation based on a distance, for thus increasing the reliability of a thin film device, whereby it is possible to fabricate a more compact product and to more easily maintain the system, which includes a heat shielding cylindrical chamber, a cylindrical chamber located within the heat shielding cylindrical chamber, a crucible section including a crucible and a heat filament arranged at an inner and lower portion of the cylindrical chamber, an ionization section having an anode and an ionization filament arranged in an upper portion inside the cylindrical chamber, and a magnet for enhancing an ionization efficiency, an upper and lower filament support for supporting the heater filament and the ionization filament, an upper and lower flange, to which the upper and lower filaments are fixed, arranged in the cylindrical chamber in order for the upper and lower filaments to be detachable, and a grounding plate extended from the heat shielding plate and the electromagnetic field blocking cylindrical chamber located at the upper direction of the crucible section and forming of an acceleration electrode system together with the upper flange.
REFERENCES:
patent: 4197814 (1980-04-01), Takagi et al.
patent: 4805555 (1989-02-01), Itoh
patent: 5100526 (1992-03-01), Ito
patent: 5211994 (1993-05-01), Tsukazaki et al.
patent: 5354445 (1994-10-01), Ito et al.
Choi Won Kook
Jang Hong Kyu
Jung Hyung Jin
Koh Seok Keun
Korea Institute of Science and Technology
Kunemund Robert M.
Lund Jeffrie R
LandOfFree
Thin film deposition apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Thin film deposition apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thin film deposition apparatus will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-858374