Microelectronic assemblies including Z-axis conductive films

Details Microelectronic assemblies including Z-axis conductive films Microelectronic assemblies including Z-axis conductive films

1996-09-24

1998-10-06

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

439 66, 439 91, 257707, 257720, H05K 310

Patent

active

058187006

ABSTRACT:
First and second electronic devices interconnected by a nonconductive nanoporous film, the film having metal-filled pores extending through the thickness of the film, such that each of the devices is contacted by the metal in at least several pores, the film having other pores that remain unfilled, in order to enhance the compressibility of the film.

REFERENCES:
patent: 3953566 (1976-04-01), Gore
patent: 4985296 (1991-01-01), Mortimer, Jr.
patent: 5019944 (1991-05-01), Ishii et al.
patent: 5286417 (1994-02-01), Mahmoud et al.
patent: 5431571 (1995-07-01), Hanrahan et al.
patent: 5538756 (1996-07-01), Korleski et al.
patent: 5613862 (1997-03-01), Naylor
IBM Technical Disclosure Bulletin vol. 30, No. 9, Feb. 1988.

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