Thermal recording head

Recorders – Thermal recording

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

219216, 338309, 428408, G01D 1510, H05B 100, H01C 1012, B32B 900

Patent

active

048455130

ABSTRACT:
A thermal recording head, which comprises at least one set of a heating resistor layer and at least one pair of electrodes electrically connected to the heating resistor layer, formed on a substrate, the heating resistor layer being composed of amorphous material comprising carbon atoms as a matrix and hydrogen atoms.

REFERENCES:
patent: 3301707 (1967-01-01), Loeb et al.
patent: 3604970 (1971-09-01), Culbertson et al.
patent: 3639165 (1972-02-01), Rairden
patent: 3645783 (1972-02-01), Rupert et al.
patent: 4036786 (1977-07-01), Tiedeman
patent: 4060660 (1977-11-01), Carlson et al.
patent: 4172718 (1979-10-01), Menzel
patent: 4296309 (1981-10-01), Shinpmi et al.
patent: 4361638 (1982-11-01), Higashi et al.
patent: 4400410 (1983-08-01), Green et al.
patent: 4436797 (1984-03-01), Brady et al.
patent: 4522663 (1985-06-01), Ovshinsky et al.
patent: 4567493 (1986-01-01), Ikeda et al.
patent: 4568626 (1986-02-01), Ogawa
patent: 4585704 (1986-04-01), Hirai et al.
patent: 4597844 (1986-07-01), Hiraki
patent: 4629514 (1986-12-01), Suda

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Thermal recording head does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thermal recording head, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermal recording head will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-855973

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.