Reworkable encapsulated electronic assembly and method of making

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

2940208, 174 522, 264300, 361713, 361736, H05K 720

Patent

active

053813049

ABSTRACT:
An improved encapsulant and method of application for rework of a modular electronic assembly. A housing is provided with a structure that permits deformation with thermal expansion of the encapsulant and reduces stresses applied to the electronic components therewithin. The selected encapsulant provides mechanical stability from shock and vibration, thermal conductivity to the surroundings, and freedom from deterioration of electrical performance. Critically, the encapsulant is readily excised for repair and replacement of defective components, thus allowing rework and salvage of the assembly. A potting tool is adapted for selectively refilling the housing to replace the excised portions.

REFERENCES:
patent: 3474531 (1964-10-01), Slenker
patent: 3608029 (1971-09-01), Hough
patent: 4118861 (1978-10-01), Palimisano
patent: 4414606 (1983-11-01), Anderson
patent: 4729062 (1988-03-01), Anderson et al.
patent: 4902368 (1990-02-01), Oldham
patent: 4933744 (1990-06-01), Segawa et al.
patent: 4991286 (1991-02-01), Russo
patent: 5057348 (1991-10-01), Drain et al.
patent: 5075821 (1991-12-01), McDonnal
patent: 5123538 (1992-06-01), Groenewegen
patent: 5250848 (1993-10-01), Christie

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Reworkable encapsulated electronic assembly and method of making does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Reworkable encapsulated electronic assembly and method of making, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Reworkable encapsulated electronic assembly and method of making will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-855249

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.